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Working with WIN
WIN Enterprises offers a wide range of commercial off the shelf (COTS) products, but its true specialty is the design and manufacture of custom solutions -- usually high-end motherboards with extended product lives. Our COTS products can be modified to meet your more exact requirements; and WIN can modify your embedded product at smaller volumes than the larger Original Design Manufacturers (ODMs).
WIN provides several value-added advantages over its competitors, providing exceptional service across the design and manufacturing phases. Customers of all size receive Tier One support. The integration of all the design and manufacturing phase reduces yours risks and speeds your products to market
WIN products are designed for long life using true embedded components. Our ability to manage a product's life cycle means we work to extend its lifetime and then provide a seamless transition to your next-generation product. In addition to design and manufacturing, WIN offers value-added services for software installation, testing, branding, package design, and drop-shipping to make your life easier.
Virtually all WIN Enterprises' products are RoHS compliant. WIN can also secure other industry validations and certifications, such as UL, TUV, CSA, etc.
WIN Enterprises will modify its existing designs based on your market needs
when you are ordering in typical OEM quantities. We will also design totally from scratch
to provide you even more product differentiation when required. Any NRE charges
will depend on the nature of the overall agreement.
Embedded Development Kits
A robust set of Development Kits based on the experience of hundreds of successful designs across a wide variety of applications will provide you with a fast time-to-market with a unique solution that differentiates your solution in your market.
WIN maintains a library of core design modules in the following application areas:
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Networking & Network Security
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Internet Appliances
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Mobile/intense Computing
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Telecommunications
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Industrial PC / Industrial Automation
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Transaction Terminals / POS Systems
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Gaming/Entertainment/Digital Home
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Medical Devices/Scientific Instrumentation
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Transportation/Automotive
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Military/Aerospace/ Law Enforcement
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Custom Embedded Solutions
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- Fully Custom Boards & Appliances
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- Our Experience Enables Fast Time-to-Market
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- Complete Design & Manufacturing Services
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- Product Life-cycle & Component Management
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- Smooth Roll-out Provided for Subsequent Product Generations
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System Definition Phase
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System definition is the most critical phase in manufacturing projects. The functionality and performance of a product are defined within this stage. This becomes the basis for determining your product’s specifications. In this phase WIN will help:
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Define the product’s objectives and functionality of each product part
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Explore alternatives for components, considering availability, reliability, and longevity
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Propose a custom solution if an off-the-shelf solution does not exist
Electronic Design / Product Development
WIN's engineering team maximizes performance while minimizing development time and overhead costs. We draw upon years of knowledge and experience to produce your customized motherboard or appliances.
Every day WIN's engineers are setting new standards for performance, reliability, and value.
During the design/development phase WIN will:
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Develop the product design
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Explore the various options available
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Develop a technology roadmap that will be used in the final phase of development
Embedded X86 Design Process
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Project Plan
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Statement of Work
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Develop Final Specification
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Review Engineering Specification
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Release Final Specification
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Develop Final Block Diagram
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Customer Review
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Accept Final Block Diagram
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Develop Schematics
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Provide Complete Mechanical Specifications
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Pre-Route
A) Signal Integrity Analysis
B) Review Specifications
C) Support Stack-Up Selection
D) Develop Routing Rules
E) Develop Pre-Routing Simulations
F) Review and Cleanse Models -
Develop Bill of Materials (BOM)
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Design Review
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Accept Schematics
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Component Placement and Mechanicals
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Baseline Thermal Model
A) Develop Baseline Thermal Profile
B) Review Worst Case Voltages and Power
C) Review Air Flow Strategy -
Design Review
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Accept Placement
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Final Thermal Simulation
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Procure Long-Lead Items for Prototypes
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Routing
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Support Routing Effort
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Cross-Reference Design Guides
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Electrical Simulation (post-route)
A) Trace Length / Impedance Analysis
B) Signal Integrity
C) Cross Talk Screening
D) Split Plane Discontinuity Analysis -
Deliver Design Files
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Final Design Review
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Accept Final Design
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PCB Manufacture
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Develop Mechanical Samples
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Assemble Prototypes
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Board Testing
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Engineering Validation
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Customer-Specific Testing
A) Application Testing
B) Certifications
C) HALT/HASS
D) MTBF/ORT -
Deliver Working Prototypes to Customer
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Release
Design Validation Process
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WIN adheres stringently to the design guides of its customers, notably Intel and AMD
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Customer Design Guides
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Post-Route Simulation
A) Trace Length / Impedance Analysis
B) Signal Integrity
C) Crosstalk Screening
D) Split Plane Discontinuity Analysis
Engineering Validation Process
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Functional Testing & Specification Verification
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Voltage Margin Testing & Analysis
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Temperature Margin Testing & Analysis
A) Develop Baseline Thermal Profile
B) Review Worst Case Voltages and Power
C) Review Air Flow Strategy
D) Perform Final Simulation
E) Thermal Analysis Tool: FloTherm
Signal Integrity Analysis: Pre-Route
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Review Specifications
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Support Stack-Up Selection
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Develop Routing Rules
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Develop Pre-Route Simulations
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Review and Cleanse Models
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SI Tools:
A) SPECTRAQuest
B) Hyperlynx
C) HSPICE
Design Validation Process
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Intel Design Guides
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Customer Design Guides
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Post-Route Simulation
A) Trace Length / Impedance Analysis
B) Signal Integrity
C) Crosstalk Screening
D) Split Plane Discontinuity Analysis
Engineering Validation Process
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Functional Testing & Specification Verification
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Voltage Margin Testing & Analysis
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Temperature Margin Testing & Analysis
A) Develop Baseline Thermal Profile
B) Review Worst Case Voltages and Power
C) Review Air Flow Strategy
D) Perform Final Simulation
E) Thermal Analysis Tool: FloTherm
Compliance & Certifications
- Functional Testing & Specification Verification
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Voltage Margin Testing & Analysis
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Temperature Margin Testing & Analysis
A) Develop Baseline Thermal Profile
B) Review Worst Case Voltages and Power
C) Review Air Flow Strategy
D) Perform Final Simulation
E) Thermal Analysis Tool: FloTherm
Routing
- 1. Procure Long-Lead Items for Prototypes
- 2. Routing
- 3. Support Routing Effort
- 4. Cross-Reference Design Guides
- 5. Electrical Simulation (post-route)
- A) Trace Length / Impedance Analysis
- B) Signal Integrity
- C) Cross Talk Screening
- D) Split Plane Discontinuity Analysis
Release to Customer
- 1. Deliver Design Files
- 2. Final Design Review
- 3. Accept Final Design
- 4. PCB Manufacture
- 5. Develop Mechanical Samples
- 6. Assemble Prototypes
- 7. Board Testing
- 8. Engineering Validation
- 9. Customer-Specific Testing
- A) Application Testing
- B) Certifications
- C) HALT/HASS
- D) MTBF/ORT
- 10. Deliver Working Prototypes to Customer
- 11. Release
Conclusion
WIN Enterprises works closely with its OEM customers to deliver embedded solutions that meet or exceed their market requirements. These designs can be COTS, modified COTS or custom platforms. NRE charges are negotiated with the customer based on the extent of the NRE effort and ultimate production volume. For instance, the cost of minor modifications may be absorbed by WIN Enterprises (production volumes allowing). Ownership of a custom design may be shared by WIN and OEM customer based on the proportion of NRE funding that is absorbed by each - or can be owned outright by the OEM, if desired. The use of development modules speeds the NRE process, ensures reliability and helps keep costs low. Designs are maximized for long product life-cycle to provide the best possible return on investment (ROI) for the OEM customer.
WIN ENTERPRISE SERVICES: HARDWARE DESIGN, MANUFACTURING & FULFILLMENT